Effects of phosphorus addition on the properties of Sn-9Zn lead-free solder alloy

被引：15

作者：

Huang, Hui-zhen ^{[1
]}

Wei, Xiu-qin ^{[1
]}

Tan, Dun-qiang ^{[1
]}

Zhou, Lang ^{[1
]}

机构：

[1] Nanchang Univ, Sch Mat Sci & Engn, Nanchang 330031, Peoples R China

来源：

INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS | 2013年 / 20卷 / 06期

基金：

中国国家自然科学基金;

关键词：

lead-free solder; phosphorus; wettability; oxidation; corrosion; CU SUBSTRATE; ZN; MICROSTRUCTURE; AG;

D O I：

10.1007/s12613-013-0766-8

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This article explores the effects of phosphorus addition on the wettability between Sn-9Zn solder alloy and Cu substrates, the oxidation behavior and the corrosion behavior of Sn-9Zn solder alloy. Spreading test was used to characterize the wettability of Sn-9Zn-xP solder alloys to Cu substrates. The oxidation and corrosion behaviors of Sn-9Zn-xP solder alloys were determined by means of weight gaining, and secondary ion mass spectrometry was used to analyze the oxygen content. The role and mechanism of P in the solder alloys were also discussed. It is found that the addition of P can significantly improve the wettability of the solder alloys. Incorporating P into Sn-9Zn solder alloy obviously decreases the oxygen content and enhances the oxidation and corrosion resistance. Microstructure observations show that an appropriate amount of P can greatly refine coarse rod-like Zn-rich phases in Sn-9Zn solder alloy.

引用

页码：563 / 567

页数：5

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