Failure mode analysis on thermally aged hydrophobic coatings applied to electro wetting

被引：7

作者：

Bonfante, Gwenael ^{[1
,2
]}

Maillard, Mathieu ^{[1
]}

Chevalliot, Stephanie ^{[2
]}

Burger, Benjamin ^{[2
]}

Berge, Bruno ^{[2
]}

Gablin, Corinne ^{[3
]}

Leonard, Didier ^{[3
]}

Toury, Berangere ^{[1
]}

机构：

[1] Univ Lyon 1, CNRS, Lab Multimat & Interfaces, UMR 5615, 43 Bd 11 Novembre 1918, F-69622 Villeurbanne, France

[2] Parrot SA, Varioptic, Batiment Tony Garnier,24 Rue Jean Baldassini, F-69007 Lyon, France

[3] Inst Sci Analyt, 5 Rue Doua, F-69100 Villeurbanne, France

来源：

THIN SOLID FILMS | 2018年 / 646卷

关键词：

Adhesion; Electrowetting; Interface; Ageing; Surface; ADHESIVE JOINTS; PLASMA TREATMENT; CONTACT ANGLES; PAINT ADHESION; SURFACE; WATER; POLYPROPYLENE; VOLTAGE; LIQUIDS; FILMS;

D O I：

10.1016/j.tsf.2017.11.034

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The aim of this study is to investigate the degradation of hydrophobic coatings at the origin of reliability failure. Various properties such as adhesion and wetting after thermal ageing have been investigated. The layers studied, parylene C, Cytop and Fluoropel deposited on silicon wafers are widely used in electrowetting, MEMS and Lab-on-chip devices. A detailed failure mode analysis is presented, involving chemical surface modification through secondary ion mass spectroscopy by time of flight, X-ray photoelectron spectroscopy, surface energy and tensile strength measurements. We've been able to identify and quantify the origin of failure for each type of coating and the method we applied can be extrapolated to other hydrophobic coating as a benchmark for reliability improvement.

引用

页码：53 / 60

页数：8

共 23 条

[1] Electrode de-wetting as a failure mechanism in thermally-aged OPV devices
Greenbank, William
Hirsch, Lionel
Chambon, Sylvain
SOLAR ENERGY MATERIALS AND SOLAR CELLS, 2018, 178 : 8 - 14
[2] Failure Mode and Effect Analysis Applied to Power Transformers
Freitag, Suelen C.
Sperandio, Mauricio
Marchesan, Tiago B.
Carraro, Rodinei
2017 52ND INTERNATIONAL UNIVERSITIES POWER ENGINEERING CONFERENCE (UPEC), 2017,
[3] Electro-Mechanical and Chemical Strength Analysis of Thermally Aged Nanofluid Impregnated Kraft Paper
Maharana, Mrutyunjay
Baruah, Niharika
Nayak, Sisir Kumar
Sahoo, Niranjan
2018 IEEE CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA (IEEE CEIDP), 2018, : 121 - 124
[4] Failure mode effect analysis applied to preparation of intravenous cytostatics
Santos-Rubio, M. D.
Marin-Gil, R.
Munoz-de la Corte, R.
Velazquez-Lopez, M. D.
Gil-Navarro, M. V.
Bautista-Paloma, F. J.
REVISTA DE CALIDAD ASISTENCIAL, 2016, 31 (02) : 106 - 112
[5] Failure mode and effect analysis applied to the procedure for intrathecal chemotherapy
de la Riva, P.
Martinez Zabaleta, M. T.
Arruti Gonzalez, M.
Urtasun Ocariz, M. A.
NEUROLOGIA, 2015, 30 (01): : 62 - 64
[6] Failure mode effect analysis applied to the use of infusion pumps
Fechter, RJ
Barba, JJ
PROCEEDINGS OF THE 26TH ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY, VOLS 1-7, 2004, 26 : 3496 - 3499
[7] Accelerated Lifetime Tests and Failure Analysis of an Electro-thermally Actuated MEMS valve
Skima, H.
Medjaher, K.
Varnier, C.
Zerhouni, N.
Dedu, E.
Bourgeois, J.
2015 27TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS (ICM), 2015, : 75 - 78
[8] Failure Mode and Effects Analysis Applied to an In-House Incident Learning System
Miller, B. M.
Chetty, I. J.
Gordon, J.
Amy, E.
Dickinson, M.
Rasmusson, B.
Movsas, B.
Siddiqui, M. U.
INTERNATIONAL JOURNAL OF RADIATION ONCOLOGY BIOLOGY PHYSICS, 2014, 90 : S129 - S129
[9] Evaluation and critique of Healthcare Failure Mode and Effect Analysis applied in a radiotherapy case study
Chadwick, Liam
Fallon, Enda F.
HUMAN FACTORS AND ERGONOMICS IN MANUFACTURING & SERVICE INDUSTRIES, 2013, 23 (02) : 116 - 127
[10] Soft Defect Localization(SDL) Applied on Analog and Mixed-mode ICs Failure Analysis
Li, Jinglong
Wu, Chunlei
2012 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2012,

← 1 2 3 →