Role of direct electron-phonon coupling across metal-semiconductor interfaces in thermal transport via molecular dynamics
被引:5
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作者:
Lin, Keng-Hua
论文数: 0引用数: 0
h-index: 0
机构:
Purdue Univ, Sch Mat Engn, W Lafayette, IN 47907 USAPurdue Univ, Sch Mat Engn, W Lafayette, IN 47907 USA
Lin, Keng-Hua
[1
]
Strachan, Alejandro
论文数: 0引用数: 0
h-index: 0
机构:Purdue Univ, Sch Mat Engn, W Lafayette, IN 47907 USA
Strachan, Alejandro
机构:
[1] Purdue Univ, Sch Mat Engn, W Lafayette, IN 47907 USA
来源:
JOURNAL OF CHEMICAL PHYSICS
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2015年
/
143卷
/
03期
基金:
美国国家科学基金会;
关键词:
KAPITZA CONDUCTANCE;
HEAT;
ALUMINUM;
AU;
D O I:
10.1063/1.4922893
中图分类号:
O64 [物理化学(理论化学)、化学物理学];
学科分类号:
070304 ;
081704 ;
摘要:
Motivated by significant interest in metal-semiconductor and metal-insulator interfaces and super-lattices for energy conversion applications, we developed a molecular dynamics-based model that captures the thermal transport role of conduction electrons in metals and heat transport across these types of interface. Key features of our model, denoted eleDID (electronic version of dynamics with implicit degrees of freedom), are the natural description of interfaces and free surfaces and the ability to control the spatial extent of electron-phonon (e-ph) coupling. Non-local e-ph coupling enables the energy of conduction electrons to be transferred directly to the semiconductor/insulator phonons (as opposed to having to first couple to the phonons in the metal). We characterize the effect of the spatial e-ph coupling range on interface resistance by simulating heat transport through a metal-semiconductor interface to mimic the conditions of ultrafast laser heating experiments. Direct energy transfer from the conduction electrons to the semiconductor phonons not only decreases interfacial resistance but also increases the ballistic transport behavior in the semiconductor layer. These results provide new insight for experiments designed to characterize e-ph coupling and thermal transport at the metal-semiconductor/ insulator interfaces. (C) 2015 AIP Publishing LLC.