Temperature dependent slip mode modification in Cu-Al solid solution alloy single crystals

被引：10
|
作者：
Ha, Jong Su [1 ]
Hong, Sun Ig [1 ]
机构：
[1] Chungnam Natl Univ, Dept Adv Mat Engn, Taejon, South Korea
来源：
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2013年 / 565卷
关键词：
Stacking fault energy; Dynamic strain aging; Planar slip; Dislocation; Cu-16 at% Al; STRAIN; DEFORMATION; BEHAVIOR; TENSION; FATIGUE;
D O I：
10.1016/j.msea.2012.12.044
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Slip mode modification of planar slip Cu-Al single crystals with low stacking fault energy was studied at various temperatures. The changes of surface slip appearance and dislocation substructure with temperature was observed and explained in terms of the roles of stacking fault energy and dynamic strain aging. (C) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码：9 / 12
页数：4
相关论文
共 50 条
  • [41] ON INFLUENCE OF STACKING FAULT ENERGY ON HIGH TEMPERATURE CREEP OF CU-AL SOLID SOLUTIONS
    PAHUTOVA, M
    HOSTINSKY, T
    CADEK, J
    SCRIPTA METALLURGICA, 1969, 3 (05): : 293 - +
  • [42] HIGH-TEMPERATURE TENSILE DEFORMATION OF CU-ZN AND CU-AL ALPHA SOLID SOLUTIONS
    ASANO, M
    IZUMI, O
    TANAKA, E
    TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS, 1968, 9 (05): : 349 - &
  • [43] Synergistic effect of orientation and temperature on slip behavior and precipitation behavior of Al-Cu-Li single crystals
    Jiang, Zhen
    Lei, Chen-qi
    Ding, Jia-jun
    Zhu, Chun-nan
    Shi, Dong-feng
    Zhang, Jin
    Wang, Guo-qing
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2024, 34 (11) : 3554 - 3568
  • [44] MARTENSITE STRUCTURE CHANGE DURING UNIAXIAL LOADING OF SINGLE-CRYSTALS OF CU-AL AND CU-AL-NI ALLOYS
    VASILENKO, AY
    PANCHENKO, SP
    FIZIKA METALLOV I METALLOVEDENIE, 1990, (06): : 89 - 94
  • [45] Deformation mechanism in alpha Cu-Al single crystals and bicrystals under scratching with pyramidal indentor
    Kobayashi, S
    Kuwata, M
    Mori, K
    Miura, S
    JOURNAL OF MATERIALS SCIENCE, 1996, 31 (21) : 5797 - 5803
  • [46] Non-isothermal reduction kinetics and mechanisms by hydrogen of Cu-Al spinel solid solution
    Liu, Ya-Jie
    Kang, He-Fei
    Zhang, Liang-Liang
    Xue, Cai-Long
    Yuan, Li-Jing
    Hou, Xiao-Ning
    Zhang, Lei
    Gao, Zhi-Xian
    CATALYSIS COMMUNICATIONS, 2023, 173
  • [47] Temperature Dependent Solid Solution Strengthening in the High Entropy Alloy CrMnFeCoNi in Single Crystalline State
    Gadelmeier, Christian
    Haas, Sebastian
    Lienig, Tim
    Manzoni, Anna
    Feuerbacher, Michael
    Glatzel, Uwe
    METALS, 2020, 10 (11) : 1 - 13
  • [48] EFFECT OF PRELIMINARY IRRADIATION ON HIGH-TEMPERATURE PHASE-TRANSFORMATIONS OF CU-AL ALLOY
    IBRAGIMOV, SS
    MELIKHOV, VD
    KIRIUSHIN, VP
    DOKLADY AKADEMII NAUK SSSR, 1978, 238 (04): : 835 - 837
  • [49] Evolution of the Cu-Al alloy/SiO2 interfaces during bias temperature stressing
    Wang, PI
    Murarka, SP
    Yang, GR
    Lu, TM
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2001, 148 (02) : G78 - G81
  • [50] TEM STUDY OF TWINNED CRYSTALS OF DEFORMATION OF MONO-CRYSTALLINE CU-AL SOLID-SOLUTIONS
    DENANOT, MF
    VERGNOL, J
    JOURNAL DE MICROSCOPIE ET DE SPECTROSCOPIE ELECTRONIQUES, 1980, 5 (03): : A9 - A9
12345