Temperature dependent slip mode modification in Cu-Al solid solution alloy single crystals

被引：10
|
作者：
Ha, Jong Su [1 ]
Hong, Sun Ig [1 ]
机构：
[1] Chungnam Natl Univ, Dept Adv Mat Engn, Taejon, South Korea
来源：
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2013年 / 565卷
关键词：
Stacking fault energy; Dynamic strain aging; Planar slip; Dislocation; Cu-16 at% Al; STRAIN; DEFORMATION; BEHAVIOR; TENSION; FATIGUE;
D O I：
10.1016/j.msea.2012.12.044
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Slip mode modification of planar slip Cu-Al single crystals with low stacking fault energy was studied at various temperatures. The changes of surface slip appearance and dislocation substructure with temperature was observed and explained in terms of the roles of stacking fault energy and dynamic strain aging. (C) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码：9 / 12
页数：4
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