Measurement of thermo-mechanical deformations of wafer-level CSP assembly under thermal cycling condition

被引：4

作者：

Ham, SJ ^{[1
]}

Lee, SB ^{[1
]}

机构：

[1] Korea Adv Inst Sci & Technol, Dept Mech Engn, CARE Elect Packaging Lab, Taejon 305701, South Korea

来源：

ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001 | 2001年

关键词：

D O I：

10.1109/EMAP.2001.984004

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The understanding of thermal deformation has been recognized as the key for a reliable electronic packaging design. In this study, thermal deformations of Ultra CSP(TM) 80 assembly during a thermal cycling were investigated using real-time high sensitivity moire interferometry. For temperature cycling, a small-sized thermal chamber having an optical window was developed. The nominal shear strain of solder joint and the warpage of the wafer-level CSP assembly were measured under a thermal cycle.

引用

页码：323 / 327

页数：5

共 7 条

[1]

CHO S, 2001, P IPACK 01

[2]

Ham SJ, 2000, P INT CONG EXPERIT M, P738

[3]

Ham SJ, 2000, PROCEEDINGS OF INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, P350, DOI 10.1109/EMAP.2000.904179

[4] Deformation mechanism of two-phase solder column interconnections under highly accelerated thermal cycling condition: An experimental study [J].