Ultrasonic power features of wire bonding and thermosonic flip chip bonding in microelectronics packaging

被引：4

作者：

Li Jun-hui ^{[1
,2
,3
]}

Han Lei ^{[1
,2
]}

Zhong Jue ^{[1
,2
]}

机构：

[1] Cent S Univ, Sch Mech & Elect Engn, Changsha 410083, Peoples R China

[2] Minist Educ, Key Lab Modern Complex Equipment Design & Extreme, Changsha 410083, Peoples R China

[3] Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Peoples R China

来源：

JOURNAL OF CENTRAL SOUTH UNIVERSITY OF TECHNOLOGY | 2008年 / 15卷 / 05期

基金：

中国国家自然科学基金;

关键词：

ultrasonic power; wedge bonding; thermosonic flip chip; input impedance; failure;

D O I：

10.1007/s11771-008-0127-3

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

The driving voltage and current signals of piezoceramic transducer (PZT) were measured directly by designing circuits from ultrasonic generator and using a data acquisition software system. The input impedance and power of PZT were investigated by using root mean square (RMS) calculation. The vibration driven by high frequency was tested by laser Doppler vibrometer (PSV-400-M2). And the thermosonic bonding features were observed by scanning electron microscope (JSM-6360LV). The results show that the input power of bonding is lower than that of no load. The input impedance of bonding is greater than that of no load. Nonlinear phase, plastic flow and expansion period, and strengthening bonding process are shown in the impedance and power curves. The ultrasonic power is in direct proportion to the vibration displacement driven by the power, and greater displacements driven by high power (> 5 W) result in welding failure phenomena, such as crack, break, and peeling off in wedge bonding. For thermosonic flip chip bonding, the high power decreases position precision of bonding or results in slippage and rotation phenomena of bumps. To improve reliability and precision of thermosonic bonding, the low ultrasonic power (about 1-5 W) should be chosen.

引用

页码：684 / 688

页数：5

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