Grain boundary engineering by application of mechanical stresses

被引:21
作者
Winning, M [1 ]
机构
[1] Rhein Westfal TH Aachen, Inst Met Kunde & Met Phys, D-52056 Aachen, Germany
关键词
grain growth; recrystallization; mechanical stress field; grain boundary engineering;
D O I
10.1016/j.scriptamat.2005.11.042
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
It is shown that an externally applied mechanical stress field can drastically change grain growth as well as recrystallization kinetics and can strongly influence the microstructure evolution, so that the application of mechanical stresses during annealing can be used as a new approach in the field of grain boundary engineering. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:987 / 992
页数:6
相关论文
共 35 条
[1]  
[Anonymous], 1976, Grain boundary structure and properties
[2]  
BOIKO YI, 1986, SOC POWDER METALL ME, V28, P14
[3]  
Borbély A, 2001, RECRYSTALLIZATION AND GRAIN GROWTH, VOLS 1 AND 2, P635
[4]   TRANSITION BANDS AND RECRYSTALLIZATION IN METALS [J].
DILLAMORE, IL ;
SMITH, CJE ;
HUTCHINSON, WB ;
MORRIS, PL .
PROCEEDINGS OF THE ROYAL SOCIETY OF LONDON SERIES A-MATHEMATICAL AND PHYSICAL SCIENCES, 1972, 329 (1579) :405-+
[5]  
Every R. L., 1974, Texture, V1, P183, DOI 10.1155/TSM.1.183
[6]  
FUJII T, 1997, JPN I MET, V61, P1283
[7]   TEXTURE DEVELOPMENT DUE TO PREFERENTIAL GRAIN-GROWTH OF HO-BA-CU-O IN 1.6-T MAGNETIC-FIELD [J].
HOLLOWAY, A ;
MCCALLUM, RW ;
ARRASMITH, SR .
JOURNAL OF MATERIALS RESEARCH, 1993, 8 (04) :727-733
[8]  
IWASAKI H, 1992, MATER SCI FORUM, V94, P759, DOI 10.4028/www.scientific.net/MSF.94-96.759
[9]  
King WE, 1997, MAT RES S C, V458, P53
[10]   Microstructural evolution during grain boundary engineering of low to medium stacking fault energy fcc materials [J].
Kumar, M ;
Schwartz, AJ ;
King, WE .
ACTA MATERIALIA, 2002, 50 (10) :2599-2612