Relationship between the Grit Cut Depth and Process Parameters in Electroplated Diamond Wire Sawing KDP Crystal

被引：7

作者：

Gao, Yufei ^{[1
]}

Ge, Peiqi ^{[1
]}

机构：

[1] Shandong Univ, Minist Educ, Key Lab High Efficiency & Clean Mech Manufacture, Jinan 250061, Shandong Provin, Peoples R China

来源：

ADVANCES IN ENGINEERING DESIGN AND OPTIMIZATION II, PTS 1 AND 2 | 2012年 / 102-102卷

关键词：

KDP crystal; Wire saw; Grit cut depth; Process parameter;

D O I：

10.4028/www.scientific.net/AMM.101-102.950

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A wire-saw cut KDP crystal geometrical model was founded and a mathematical model was established to calculate the grit average cut depth, based on indentation fracture mechanics theory(IFMT). The relationship between the grit cut depth and wire saw process parameter was analyzed theoretically. The research results indicate that there exists an approximate monotone increasing non-linear correlation between grit average cut depth and the ratio i value of crystal feed speed and wire speed. By increasing the wire speed and crystal feed speed accordantly, the value of i can be maintained invariable, however, this way can simultaneously bring higher machined surface quality and machining efficiency.

引用

页码：950 / 953

页数：4