Thin Film Thermoelectric Metal-Organic Framework with High Seebeck Coefficient and Low Thermal Conductivity

被引：248

作者：

Erickson, Kristopher J. ^{[1
]}

Leonard, Francois ^{[1
]}

Stavila, Vitalie ^{[1
]}

Foster, Michael E. ^{[1
]}

Spataru, Catalin D. ^{[1
]}

Jones, Reese E. ^{[1
]}

Foley, Brian M. ^{[2
]}

Hopkins, Patrick E. ^{[2
]}

Allendorf, Mark D. ^{[1
]}

Talin, A. Alec ^{[1
]}

机构：

[1] Sandia Natl Labs, Livermore, CA 94551 USA

[2] Univ Virginia, Dept Mech & Aerosp Engn, Charlottesville, VA 22904 USA

来源：

ADVANCED MATERIALS | 2015年 / 27卷 / 22期

关键词：

metal-organic frameworks; Seebeck; thermal conductivity; thermoelectric; thin films; MOF-5;

D O I：

10.1002/adma.201501078

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

A new thermoelectric material with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal-organic framework (MOF) using the guest@MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

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收藏

页码：3453 / 3459

页数：7

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