Incorporating Yttrium into a GeO Interfacial Layer with HfO2-Based Gate Stack on Ge

被引:6
作者
Chou, Chen-Han [1 ,2 ]
Lu, Yu-Hong [1 ,2 ]
Tsai, Yi-He [3 ]
Shih, An-Shih [1 ,2 ]
Yeh, Wen-Kuan [4 ]
Chien, Chao-Hsin [1 ,2 ]
机构
[1] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu 30010, Taiwan
[2] Natl Chiao Tung Univ, Inst Elect, Hsinchu 30010, Taiwan
[3] Natl Chiao Tung Univ, Nanotechnol Dept Mat Sci & Engn, Hsinchu 30010, Taiwan
[4] Natl Nano Device Labs, Hsinchu 30078, Taiwan
关键词
PASSIVATION;
D O I
10.1149/2.0161802jss
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this study, we employed the electrical and material properties of various interfacial layers (ILs) such as GeO and YGeO on a Ge substrate. First, capacitors using various ILs with HfO2-based gate stacks were developed. The capacitor using YGeO IL exhibited a low interface state density (D-it) of 2.5 x 10(11) eV(-1)cm(-2) and an equivalent oxide thickness of 1.8 nm. Next, a reliability test for constant voltage stress was conducted for further studying the YGeO ILs. The capacitors with YGeO ILs presented higher immunity for Dit degradation. Further, to understand the material properties of various ILs, a simple experiment on capping a Si chip on GeO or YGeO/Ge samples through high-temperature annealing was conducted. We observed that Ge and GeO vapors can be absorbed by Si and detected through X-ray photoelectron spectroscopy (XPS). XPS spectra of Si chips capped on GeO IL presented obvious features of Ge and GeO through annealing at 500 degrees C; however, the XPS spectra of Si chips capped on YGeO IL presented no features, indicating that YGeO ILs had higher thermal stability than GeO ILs. To further analyze the HfO2-based gate stacks with various ILs, Ge diffusion into a high-k HfO2 layer was investigated through angle-resolved XPS. We observed that YGeO ILs with HfO2-based gate stacks can reduce Ge diffusion into a HfO2 layer. (C) 2018 The Electrochemical Society.
引用
收藏
页码:N15 / N19
页数:5
相关论文
共 25 条
[1]   Comparison between Direct-Contact HfO2/Ge and HfO2/GeO2/Ge Structures: Physical and Electrical Properties [J].
Abe, Yasuhiro ;
Miyata, Noriyuki ;
Yasuda, Tetsuji .
PHYSICS AND TECHNOLOGY OF HIGH-K GATE DIELECTRICS 6, 2008, 16 (05) :375-+
[2]   Passivation of Ge(100)/GeO2/high-κ gate stacks using thermal oxide treatments [J].
Bellenger, F. ;
Houssa, M. ;
Delabie, A. ;
Afanas'ev, V. V. ;
Conard, T. ;
Caymax, M. ;
Meuris, M. ;
De Meyer, K. ;
Heyns, M. M. .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2008, 155 (02) :G33-G38
[3]   Interface control of high-k gate dielectrics on Ge [J].
Caymax, M. ;
Houssa, M. ;
Pourtois, G. ;
Bellenger, F. ;
Martens, K. ;
Delabie, A. ;
Van Elshocht, S. .
APPLIED SURFACE SCIENCE, 2008, 254 (19) :6094-6099
[4]   Control of the interfacial layer thickness in hafnium oxide gate dielectric grown by PECVD [J].
Choi, KJ ;
Park, JB ;
Yoon, SG .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2003, 150 (04) :F75-F77
[5]   Low-Leakage Tetragonal ZrO2 (EOT < 1 nm) With In Situ Plasma Interfacial Passivation on Germanium [J].
Chou, Chen-Han ;
Chang, Hao-Hsuan ;
Hsu, Chung-Chun ;
Yeh, Wen-Kuan ;
Chien, Chao-Hsin .
IEEE ELECTRON DEVICE LETTERS, 2016, 37 (02) :138-141
[6]   H2O- and O3-Based Atomic Layer Deposition of High-κ Dielectric Films on GeO2 Passivation Layers [J].
Delabie, A. ;
Alian, A. ;
Bellenger, F. ;
Caymax, M. ;
Conard, T. ;
Franquet, A. ;
Sioncke, S. ;
Van Elshocht, S. ;
Heyns, M. M. ;
Meuris, M. .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2009, 156 (10) :G163-G167
[7]   Effective electrical passivation of Ge(100) for high-k gate dielectric layers using germanium oxide [J].
Delabie, Annelies ;
Bellenger, Florence ;
Houssa, Michel ;
Conard, Thierry ;
Van Elshocht, Sven ;
Caymax, Matty ;
Heyns, Marc ;
Meuris, Marc .
APPLIED PHYSICS LETTERS, 2007, 91 (08)
[8]   Direct comparison of ZrO2 and HfO2 on Ge substrate in terms of the realization of ultrathin high-κ gate stacks [J].
Kamata, Y ;
Kamimuta, Y ;
Ino, T ;
Nishiyama, A .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2005, 44 (4B) :2323-2329
[9]   Control of high-k/germanium interface properties through selection of high-k materials and suppression of GeO volatilization [J].
Kita, Koji ;
Takahashi, Toshitake ;
Nomura, Hideyuki ;
Suzuki, Sho ;
Nishimura, Tomonori ;
Toriumi, Akira .
APPLIED SURFACE SCIENCE, 2008, 254 (19) :6100-6105
[10]  
Lu C., 2015, VLSI S, V18