A survey of automated material handling systems in 300-mm semiconductor fabs

被引：74
作者：
Agrawal, GK [1 ]
Heragu, SS
机构：
[1] Rensselaer Polytech Inst, Dept Decis Sci & Engn Syst, Troy, NY 12180 USA
[2] Univ Louisville, Dept Ind Engn, Louisville, KY 40292 USA
来源：
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | 2006年 / 19卷 / 01期
关键词：
automated material handling systems (AMHS); fab layouts; survey; 300-mm semiconductor manufacturing;
D O I：
10.1109/TSM.2005.863217
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The fast-paced developments and technological breakthroughs in the semiconductor manufacturing industry elevates the importance of optimum utilization of resources. The newer 300-mm wafers fabs place a high level of emphasis on increasing yield and reducing cycle times. Automated material handling, systems are important tools that help us achieve these objectives. In addition, due to the increased weight and size of 300-mm wafers, an automated material handling system is a must for a 300-mm manufacturing facility. This paper discusses various approaches for automated materials handling in semiconductor manufacturing industries.
引用
收藏
页码：112 / 120
页数：9
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