Thermal Performance of Data Centers-Rack Level Analysis

被引：13

作者：

Fakhim, Babak ^{[1
]}

Srinarayana, Nagarathinam ^{[1
]}

Behnia, Masud ^{[1
]}

Armfield, Steven W. ^{[1
]}

机构：

[1] Univ Sydney, Sch Aerosp Mech & Mechatron Engn, Sydney, NSW 2006, Australia

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2013年 / 3卷 / 05期

关键词：

Cooling; data center; rack level analysis; thermal performance;

D O I：

10.1109/TCPMT.2013.2248195

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper analyzes the thermal performance of a data center on a rack level, by utilizing racks stocked with 1U servers. Eleven different rack models covering a wide range of server arrangements with void spaces are presented and modeled in a raised-floor configuration. The objective is to investigate the thermal performance of semipopulated racks with different server arrangements. The inlet and outlet temperature profiles of the models are presented and the overall effect of each model on the thermal performance of a specific rack is discussed. Findings point toward the detailed modeling of semipopulated racks to investigate the main locations of the temperature spikes adjacent to the rack inlet and outlets as well as the recirculation zones.

引用

页码：792 / 799

页数：8

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