Effect of critical plasma spray parameter on complex permittivity and microstructure by plasma spraying Cr/Al2O3 coatings

被引：40

作者：

Zhao, Dong ^{[1
]}

Luo, Fa ^{[1
]}

Zhou, Wancheng ^{[1
]}

Zhu, Dongmei ^{[1
]}

机构：

[1] Northwestern Polytech Univ, State Key Lab Solidificat Proc, Xian 710072, Peoples R China

来源：

APPLIED SURFACE SCIENCE | 2013年 / 264卷

关键词：

Plasma spray; Complex permittivity; Critical plasma spray parameters; Cr/Al2O3; coatings; MICROWAVE ABSORBING PROPERTIES; COMPOSITES; INJECTION; PROPERTY; MATRIX; RESIN;

D O I：

10.1016/j.apsusc.2012.10.061

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

In this paper, Cr/Al2O3 coatings formed via a plasma spray approach with different critical plasma spray parameters using Al2O3 and Cr powder feeds were prepared. The effects of CPSP on the phase composition, microstructure, complex permittivity, porosity and adhesive strength of the coatings were investigated. The microstructure and phase composition of coatings were examined using scanning electron microscope (SEM) and X-ray diffraction (XRD). XRD analysis reveal that Cr, gamma-Al2O3 and alpha-Al2O3 are found in all the coatings, and percentage of gamma-Al2O3 is increased due to complete melting of the particles and their consequent rapid solidification. The experimental results have shown that the CPSP condition has significant influence on the microstructure and complex permittivity of the coatings. Both the real part (epsilon') and imaginary part (epsilon '') of relative complex permittivity are increased with improving the CPSP condition. Crown Copyright (C) 2012 Published by Elsevier B.V. All rights reserved.

引用

页码：545 / 551

页数：7

共 31 条

[31] Effect of in-flight particle characteristics on the coating properties of atmospheric plasma-sprayed 8 mol% Y2O3-ZrO2 electrolyte coating studying by artificial neural networks [J].

Zhang, Chao ;

Kanta, Abdoul-Fatah ;

Li, Cheng-Xin ;

Li, Chang-Jiu ;

Planche, Marie-Pierre ;

Liao, Hanlin ;

Coddet, Christain .

SURFACE & COATINGS TECHNOLOGY, 2009, 204 (04) :463-469

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