Ag-Metal Bonding Conditions for Low-Loss Double-Metal Waveguide for Terahertz Quantum Cascade Laser

被引：5

作者：

Ying, Leiying ^{[1
]}

Horiuchi-Ikeda, Noriaki ^{[1
]}

Hirayama, Hideki ^{[1
]}

机构：

[1] RIKEN, Aoba Ku, Sendai, Miyagi 9800845, Japan

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS | 2008年 / 47卷 / 10期

基金：

日本学术振兴会;

关键词：

metal bonding; quantum cascade laser; double-metal waveguide; surface plasmon waveguide; diffusion barrier;

D O I：

10.1143/JJAP.47.7926

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

the development of high-performance terahertz quantum cascade lasers (THz-QCLs), the use of a Ag double-metal waveguide (DMW) is attractive because it has low propagation-loss and high thermal conductivity. In this study, we investigated the Ag-metal bonding conditions for the DMW of THz-QCL. GaAs wafers were bonded to-ether with Ag-metal layers by applying high-pressure and heat. We achieved successfull Ag bonding Ag 400 degrees C with an applied pressure of 38.5 ka/cm(2) for 30 min in N(2) ambient. A thin Ti adhesion layer was inserted between Ag and GaAs. The Ti layer (thickness >= 10 nm) was, in addition, found to act as a barrier preventing Ag diffusion into GaAs at temperatures below 400 degrees C.

引用

收藏

页码：7926 / 7928

页数：3

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