Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes

被引：21

作者：

Chuang, TH ^{[1
]}

Yen, SF ^{[1
]}

Cheng, MD ^{[1
]}

机构：

[1] Natl Taiwan Univ, Inst Mat Sci & Engn, Taipei 106, Taiwan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2006年 / 35卷 / 02期

关键词：

Sn3Ag0.5Cu; Sn3Ag0.5Cu0.06Ni0.01Ge; Au/Ni surface finishes; ball-grid-array package; intermetallic compounds;

D O I：

10.1007/BF02692450

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The intermetallic compounds (IMCs) formed during the reflow and aging of Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes were investigated. After reflow, the thickness of (Cu, Ni, Au)(6)Sn-5 interfacial IMCs in Sn3Ag0.5Cu0.06Ni0.01Ge was similar to that in the Sn3Ag0.5Cu specimen. The interiors of the solder balls in both packages contained Ag3Sn precipitates and brick-shaped AuSn4 IMCs. After aging at 150 degrees C, the growth thickness of the interfacial (Ni, Cu, Au)(3)Sn-4 intermetallic layers and the consumption of the Ni surface-finished layer on Cu the pads in Sn3Ag0.5Cu0.06Ni0.01Ge solder joints were both slightly less than those in Sn3Ag0.5Cu. In addition, a coarsening phenomenon for AuSn4 IMCs could be observed in the solder matrix of Sn3Ag0.5Cu, yet this phenomenon did not occur in the case of Sn3Ag0.5Cu0.06Ni0.01Ge. Ball shear tests revealed that the reflowed Sn3Ag0.5Cu0.06Ni0.01Ge packages possessed bonding strengths similar to those of the Sn3Ag0.5Cu. However, aging treatment caused the ball shear strength in the Sn3Ag0.5Cu packages to degrade more than that in the Sn3Ag0.5Cu0.06Ni0.01Ge packages.

引用

页码：302 / 309

页数：8

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