Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil

被引：18
作者：
Xiao, Yong [1 ,2 ]
Song, Zhipeng [1 ]
Li, Shan [1 ]
Li, Dan [1 ]
Zhang, Zhihao [3 ]
Li, Mingyu [4 ]
Goodall, Russell [2 ]
机构：
[1] Wuhan Univ Technol, Sch Mat Sci & Engn, Wuhan 430070, Peoples R China
[2] Univ Sheffield, Dept Mat Sci & Engn, Sheffield S1 3JD, S Yorkshire, England
[3] Xiamen Univ, Coll Mat, Fujian Key Lab Adv Mat, Xiamen 361005, Peoples R China
[4] Harbin Inst Technol Shenzhen, Flexible Printing Elect Technol Ctr, Shenzhen 518055, Peoples R China
来源：
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2020年 / 791卷
关键词：
Ultrafine grained Al alloy; Ni-foam/Sn composite solder; Ultrasonic soldering; Microstructure; Bonding mechanism; ALUMINUM-OXIDE FILMS; LOW-TEMPERATURE; ALPHA-ALUMINA; CAVITATION; PHASE; MICROSTRUCTURE; ALLOYS; GROWTH; INTERFACES; PARTICLES;
D O I：
10.1016/j.msea.2020.139691
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Ni-foam reinforced Sn-based composite solder was employed to join ultrafine grain 7075 Al alloy with the assistance of ultrasound. The solder seam was mainly composed of Ni skeletons, Sn-based solder, alpha-Al phase and very fine (hundreds of nanometers to several microns diameter) Ni3Sn4 particles. Discontinuous networks surrounded by the fine Ni3Sn4 and alpha-Al particles were in-situ formed in the solder seam, the diameter of which was decreased with increasing soldering time. Smooth transition of the lattice from Al substrate to Sn-based solder was achieved by the formation of an amorphous A1(2)O(3) interlayer at the interface. The microstructure evolution mechanism and the amorphous Al2O3 interlayer formation mechanism are discussed in detail. The shear strength of Al/Ni-Sn/Al joints increased with prolonging soldering time. The Al/Ni-Sn/Al joint ultrasonically soldered for 60 s exhibits a shear strength of 71.4 MPa, which was approximately 37% higher than that soldered with pure Sn solder.
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页数：9
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共 43 条
[1]   Bubbles in an acoustic field: An overview [J].
Ashokkumar, Muthupandian ;
Lee, Judy ;
Kentish, Sandra ;
Grieser, Franz .
ULTRASONICS SONOCHEMISTRY, 2007, 14 (04) :470-475
[2]   Calorimetric study and thermal analysis of Al-Sn system [J].
Balanovic, Ljubisa ;
Zivkovic, Dragana ;
Manasijevic, Dragan ;
Minic, Dusko ;
Marjanovic, Bata .
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 2013, 111 (02) :1431-1435
[3]   Selective Ultrasonic Cavitation on Patterned Hydrophobic Surfaces [J].
Belova, Valentina ;
Gorin, Dmitry A. ;
Shchukin, Dmitry G. ;
Moehwald, Helmuth .
ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, 2010, 49 (39) :7129-7133
[4]   Thermodynamic model for solid-state amorphization in binary systems at interfaces and grain boundaries [J].
Benedictus, R ;
Bottger, A ;
Mittemeijer, EJ .
PHYSICAL REVIEW B, 1996, 54 (13) :9109-9125
[5]   MOLECULAR-DYNAMICS SIMULATIONS OF ALPHA-ALUMINA AND GAMMA-ALUMINA SURFACES [J].
BLONSKI, S ;
GAROFALINI, SH .
SURFACE SCIENCE, 1993, 295 (1-2) :263-274
[6]   Effect of Power and Frequency on Bubble-Size Distributions in Acoustic Cavitation [J].
Brotchie, Adam ;
Grieser, Franz ;
Ashokkumar, Muthupandian .
PHYSICAL REVIEW LETTERS, 2009, 102 (08)
[7]   Thermodynamic modelling of the O-Sn system [J].
Cahen, S ;
David, N ;
Fiorani, JM ;
Maître, A ;
Vilasi, M .
THERMOCHIMICA ACTA, 2003, 403 (02) :275-285
[8]   Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets [J].
Chen, Guang ;
Wu, Fengshun ;
Liu, Changqing ;
Silberschmidt, Vadim V. ;
Chan, Y. C. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 656 :500-509
[9]   Selective aggregation by ultrasonic standing waves through gas nuclei on the particle surface [J].
Chen, Yuran ;
Zheng, Hanrui ;
Truong, Vu N. T. ;
Xie, Guangyuan ;
Liu, Qingxia .
ULTRASONICS SONOCHEMISTRY, 2020, 63
[10]   Building a nano-crystalline α-alumina layer at a liquid metal/sapphire interface by ultrasound [J].
Cui, Wei ;
Yan, Jiuchun ;
Dai, Yan ;
Li, Dandan .
ULTRASONICS SONOCHEMISTRY, 2015, 22 :108-112
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