The Future of Interconnects: Challenges and Enabling Technologies

被引：0
作者：
Lin, Kevin [1 ]
Chandhok, Manish [1 ]
Reshotko, Miriam [1 ]
机构：
[1] Intel Corp, Components Res, Santa Clara, CA 95051 USA
来源：
2018 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC) | 2018年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：2 / 3
页数：2
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