Excimer lasers enable next-generation ICs

被引:0
|
作者
Das, P
Rebitz, K
机构
来源
LASER FOCUS WORLD | 1997年 / 33卷 / 06期
关键词
D O I
暂无
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Deep-UV laser sources are replacing mercury arc lamps currently used with lithography tools to manufacture state-of-the-art semiconductor chips.
引用
收藏
页码:89 / &
页数:5
相关论文
共 50 条
  • [1] NEXT-GENERATION ANALOG - ADVANCED LINEAR ICS
    不详
    EDN, 1989, 34 (18) : 56 - 58
  • [2] DEVELOPING NEXT-GENERATION LASERS FOR PRODUCTION
    ASHLEY, S
    MECHANICAL ENGINEERING, 1992, 114 (06) : 14 - 14
  • [3] LOAs enable next-generation metro networks
    Anon
    Lightwave, 2001, 18 (06):
  • [4] Monolithic optics enable next-generation designs
    Belt, RT
    Fine, KR
    PHOTONICS SPECTRA, 2004, 38 (11) : 76 - 78
  • [5] How NanoLED Will Enable Next-Generation Displays
    Ishida T.
    Nakanishi Y.
    Iwata N.
    Izumi M.
    Information Display, 2023, 39 (03) : 26 - 30
  • [6] Enabling next-generation ICs with photonics tools.
    Dessau, KL
    Van Pelt, A
    Zeman, M
    SOLID STATE TECHNOLOGY, 2004, 47 (02) : 30 - +
  • [7] Development of next generation excimer lasers for industrial applications
    Borisov, VM
    Demin, AI
    Eltsov, AV
    Khristoforov, OB
    Kiryukhin, YB
    Prokofiev, AV
    Vinokhodov, AY
    Vodchits, VA
    ADVANCED LASERS AND SYSTEMS, 2002, 5137 : 241 - 249
  • [8] Harnessing Light to Enable Next-Generation Microwave Systems
    Drubin, Cliff
    MICROWAVE JOURNAL, 2021, 64 (05) : 43 - 43
  • [9] Mask absorber development to enable next-generation EUVL
    Philipsen, Vicky
    Luong, Kim Vu
    Opsomer, Karl
    Souriau, Laurent
    Rip, Jens
    Detavernier, Christophe
    Erdmann, Andreas
    Evanschitzky, Peter
    Laubis, Christian
    Hoenicke, Philipp
    Soltwisch, Victor
    Hendrickx, Eric
    XXVI SYMPOSIUM ON PHOTOMASK AND NEXT-GENERATION LITHOGRAPHY MASK TECHNOLOGY (PHOTOMASK JAPAN 2019), 2019, 11178
  • [10] Starbugs: Piezoelectric robots enable next-generation astronomy
    Gilbert, James
    LASER FOCUS WORLD, 2014, 50 (03): : 52 - 55