QUANTITATIVE CHARACTERIZATION OF MICROSTRUCTURE OF PURE COPPER PROCESSED BY ECAP

被引:7
作者
Sedivy, Ondrej [1 ]
Benes, Viktor [1 ]
Ponizil, Petr [2 ]
Kral, Petr [3 ]
Sklenicka, Vaclav [3 ]
机构
[1] Charles Univ Prague, Fac Math & Phys, Dept Probabil & Math Stat, CZ-18675 Prague, Czech Republic
[2] Tomas Bata Univ Zlin, Fac Technol, Dept Phys & Mat Engn, CZ-76272 Zlin, Czech Republic
[3] Acad Sci Czech Republic, Inst Phys Mat, CZ-61662 Brno, Czech Republic
关键词
electron backscatter diffraction; equal-channel angular pressing; random marked sets; second-order analysis; ELECTRON BACKSCATTER DIFFRACTION; ULTRAFINE-GRAINED METALS; CREEP-BEHAVIOR; DUCTILITY; ALLOY; NANOCRYSTALLINE; DEFORMATION; BOUNDARIES; STRESS; SLIP;
D O I
10.5566/ias.v32.p65-75
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Orientation imaging microscopy (OIM) allows to measure crystallic orientations at the surface of a material. Digitalized data representing the orientations are processed to recognize the grain structure and they are visualized in crystal orientation maps. Analysis of the data firstly consists in recognition of grain boundaries followed by identification of grains themselves. Knowing the grain morphology, it is possible to characterize the grain size homogeneity and estimate structural parameters related to the physical properties of the material. The paper describes methods of imaging and quantitative characterization of the grain boundary structure in metals based on data from electron backscatter diffraction (EBSD). These methods are applied to samples of copper processed by equal-channel angular pressing (ECAP).
引用
收藏
页码:65 / 75
页数:11
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