Open Source, Modular, Customizable, 3-D Printed Kinesthetic Haptic Devices

被引:0
|
作者
Martinez, Melisa Orta [1 ]
Campion, Joseph [1 ]
Gholami, Tara [1 ]
Rittikaidachar, Michal K. [1 ]
Barron, Aaron C. [1 ]
Okamura, Allison M. [1 ]
机构
[1] Stanford Univ, Dept Mech Engn, Stanford, CA 94305 USA
基金
美国国家科学基金会;
关键词
PADDLE; DESIGN;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Open Source Hardware allows users to share, customize, and improve designs, thus enabling technological advancement through communities of practice. We propose open source hardware for educational haptics that permits researchers, educators, and students to share designs arising from their different perspectives, with the potential to expand educational applications. In this paper we present a family of open source kinesthetic haptic devices that build upon the design of a previous educational haptic device, Hapkit 3.0. First, we discuss methods for Hapkit personalization and customization that can be achieved by K-12 students and educators. Next, we describe two kinesthetic haptic device designs that evolved from the original Hapkit 3.0. One uses two standard Hapkits with additional components to form a Pantograph mechanism, and the other uses customized Hapkit elements along with a novel kinematic design to form a serial mechanism. These designs are modular; after building two Hapkits, a user acquires a small number of additional parts to transform them into a two-degree-of-freedom device. The Pantograph mechanism was used in an undergraduate class to teach robotics and haptics to both engineering and non-engineering students. Open source designs for all devices as well as tutorials for customization are available at http://hapkit.stanford.edu.
引用
收藏
页码:142 / 147
页数:6
相关论文
共 50 条
  • [21] A 3D Printed Soft Robotic Monolithic Unit for Haptic Feedback Devices
    Singh, Dilpreet
    Tawk, Charbel
    Mutlu, Rahim
    Sariyildiz, Emre
    Alici, Gursel
    2019 IEEE/ASME INTERNATIONAL CONFERENCE ON ADVANCED INTELLIGENT MECHATRONICS (AIM), 2019, : 388 - 393
  • [22] Compatibility of 3-D printed devices in cleanroom environments for semiconductor processing
    Pasanen, T. P.
    von Gastrow, G.
    Heikkinen, I. T. S.
    Vahanissi, V.
    Savin, H.
    Pearce, J. M.
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2019, 89 : 59 - 67
  • [23] Monolithic Stereolithography 3-D Printed Microwave Passive Waveguide Devices
    Li, Jin
    Huang, Guanlong
    Yuan, Tao
    2018 IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION & USNC/URSI NATIONAL RADIO SCIENCE MEETING, 2018, : 1689 - 1690
  • [24] Open-source parametric 3-D printed slot die system for thin film semiconductor processing
    Beeker, L. Y.
    Pringle, Adam M.
    Pearce, Joshua M.
    ADDITIVE MANUFACTURING, 2018, 20 : 90 - 100
  • [25] 3-D - Printed House Powers 3-D - Printed Vehicle, and Vice Versa
    不详
    ASHRAE JOURNAL, 2015, 57 (12) : 8 - 8
  • [26] Free and open-source automated 3-D microscope
    Wijnen, Bas
    Petersen, Emily E.
    Hunt, Emily J.
    Pearce, Joshua M.
    JOURNAL OF MICROSCOPY, 2016, 264 (02) : 238 - 246
  • [27] OPEN SOURCE, 3-D TERRAIN VISUALIZATION ON A MOBILE DEVICE
    Rios, Joseph
    Hogan, Patrick
    Gaskins, Tom
    Collins, David
    2014 IEEE/AIAA 33RD DIGITAL AVIONICS SYSTEMS CONFERENCE (DASC), 2014,
  • [28] A versatile and customizable low-cost 3D-printed open standard for microscopic imaging
    Benedict Diederich
    René Lachmann
    Swen Carlstedt
    Barbora Marsikova
    Haoran Wang
    Xavier Uwurukundo
    Alexander S. Mosig
    Rainer Heintzmann
    Nature Communications, 11
  • [29] A modular and customizable open-source package for quantum voltage standards operation and control
    Durandetto, Paolo
    Sosso, Andrea
    PLOS ONE, 2018, 13 (12):
  • [30] A versatile and customizable low-cost 3D-printed open standard for microscopic imaging
    Diederich, Benedict
    Lachmann, Rene
    Carlstedt, Swen
    Marsikova, Barbora
    Wang, Haoran
    Uwurukundo, Xavier
    Mosig, Alexander S.
    Heintzmann, Rainer
    NATURE COMMUNICATIONS, 2020, 11 (01)