Flip-chip ball grid array lead-free solder joint under reliability test

被引:8
作者
Jen, MHR
Liu, LC
Wu, JD
机构
[1] Natl Sun Yat Sen Univ, Dept Mech & Electromech Engn, Kaohsiung 807, Taiwan
[2] Adv Semicond Engn Inc, Proc Engn Div, Kaohsiung, Taiwan
关键词
flip-chip; bump/UBM; BGA; lead-free solder; reliability test;
D O I
10.1115/1.2070090
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The work is aimed to investigate the mechanical responses of bare dies of the combination of pure tin/Al-NiV-Cu Under bump metallization (UBM) and packages of pure tin/Al-NiV-Cu UBM/substrate of standard thickness of aurum. The mechanical properties under multiple reflow and long term high temperature storage test (HTST) tests at different temperatures and the operational life were obtained. A scanning electron microscope was used to observe the growth of IMC and the failure modes in order to realize their reaction and connection. From the empirical results of bare dies, the delamination between IMC and die was observed due to the tests at 260 degrees C multiple reflow. However their mechanical properties were not affected. Nevertheless, the bump shear strength of bare dies were decreased by HTST tests. In package, all the results of mechanical properties by multiple reflow test and HTST test were significantly lowered. It was shown that the adhesion between bump and die reduced obviously as tests going on. As for high temperature operational life test in the conditions of 150 degrees C and 320 mA (5040 A/cm(2)), the average stable service time of the package was 892 h, and the average ultimate service time of the package was 1053 h.
引用
收藏
页码:446 / 451
页数:6
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