共 50 条
[42]
Fluxless Sn-Ag solder ball formation for flip-chip application
[J].
OPTOELECTRONIC PACKAGING,
1996, 2691
:54-60
[43]
A Comprehensive Study of Electromigration in Lead-free Solder Joint
[J].
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020),
2020,
:284-289
[48]
Effect of Temperature Cycling on Reliability of Flip Chip Solder Joint
[J].
2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT),
2014,
:989-991
[49]
Reliability analysis of lead-free solder castellations
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2008, 31 (01)
:13-22