Electrical and structural properties of AlN/GaN and AlGaN/GaN heterojunctions

被引:29
作者
Polyakov, A. Y. [1 ]
Smirnov, N. B. [1 ]
Govorkov, A. V. [1 ]
Markov, A. V. [1 ]
Yugova, T. G. [1 ]
Dabiran, A. M. [2 ]
Wowchak, A. M. [2 ]
Cui, B. [2 ]
Osinsky, A. V. [2 ]
Chow, P. P. [2 ]
Pearton, S. J. [3 ]
Scherbaichev, K. D. [4 ]
Bublik, V. T. [4 ]
机构
[1] Inst Rare Met, Moscow 119017, Russia
[2] SVT Associates, Inc, Eden Prairie, MN 55344 USA
[3] Univ Florida, Dept Mat Sci & Engn, Gainesville, FL 32611 USA
[4] Moscow Steel & Alloys Inst, Dept Semicond Mat Sci, Moscow 117936, Russia
基金
俄罗斯基础研究基金会;
关键词
D O I
10.1063/1.2973463
中图分类号
O59 [应用物理学];
学科分类号
摘要
The electrical and structural properties of AlN/GaN heterostructures grown by molecular beam epitaxy on sapphire are compared with those of AlGaN/GaN heterostructures. The structural characteristics as assessed by x-ray diffraction show little difference but the electron density in the two-dimensional electron gas is about twice higher for AlN/GaN structures with only slightly lower mobility than in AlGaN/GaN. By proper choice of the Fe doping in GaN(Fe) and the thickness of unintentionally doped GaN layers, the composite buffer of the structure can be Made semi-insulating. The current through the AlN/GaN structures is determined by tunneling through the AlN barrier and is much higher than that for AlGaN/GaN films due to the lower thickness of AlN compared to AlGaN. Increasing the thickness of AlN from 3 to 4 mn decreases the leakage current by about an order of magnitude. (C) 2008 American Institute of Physics.
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页数:6
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