On the Origin of the Coss-Losses in Soft-Switching GaN-on-Si Power HEMTs

被引:70
作者
Guacci, Mattia [1 ]
Heller, Morris [1 ]
Neumayr, Dominik [1 ]
Bortis, Dominik [1 ]
Kolar, Johann W. [1 ]
Deboy, Gerald [2 ]
Ostermaier, Clemens [2 ]
Haeberlen, Oliver [2 ]
机构
[1] Swiss Fed Inst Technol, Power Elect Syst Lab, CH-8092 Zurich, Switzerland
[2] Austria AG, Infineon Technol, A-9500 Villach, Austria
关键词
C-oss-lasses; calorimetric loss measurements; gallium nitride-on-silicon (GaN-on-Si) high electron mobility transistors (HEMTs); soft-switching losses;
D O I
10.1109/JESTPE.2018.2885442
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The unprecedented performance potential of gallium nitride-on-silicon (GaN-on-Si) high electron mobility transistors (HEMTs) is seen as the key enabler for the design of power converters featuring extreme power density figures, as demanded in next-generation power electronics applications. However, unexpected loss mechanisms, i.e. dynamic R-d(s,on) phenomena and C-oss-losses, are appearing in currently available GaN transistors and are compromising their operation. In this paper, measurements of C-oss-losses are performed in a dedicated calorimetric measurement setup and, through a systematic approach, the root cause of the loss mechanism is potentially identified. Afterward, with the essential support of a manufacturer of power semiconductors, a novel transistor, featuring an enhanced multilayer III-N buffer, is developed according to the acquired knowledge. A significant reduction in terms of C-oss-lasses, i.e. of soft-switching losses, and the absence of dynamic R-ds,R-on phenomena are verified experimentally on the new device. These achievements enable a significant performance improvement for future soft-switching power converters featuring GaN-on-Si HEMTs.
引用
收藏
页码:679 / 694
页数:16
相关论文
共 30 条
[1]  
[Anonymous], H48 6G THERM COND PA
[2]  
[Anonymous], C1206C101KCGACTU
[3]  
[Anonymous], C3D1P7060Q REV F
[4]  
[Anonymous], IGT60R070D1 KEMET IN
[5]  
[Anonymous], C5750X6S2W225K250KA
[6]  
[Anonymous], 2017, IEDM, DOI DOI 10.1109/IEDM.2017.8268491
[7]  
[Anonymous], FIB OPT THERM FOTEMP
[8]  
[Anonymous], C4AT FILM MET POL PO
[9]  
[Anonymous], FLIR A655SC
[10]  
[Anonymous], IEEE T IND APPL