Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

被引:38
作者
Yakymovych, A. [1 ,2 ]
Plevachuk, Yu. [2 ]
Svec, P., Sr. [3 ]
Svec, P. [3 ]
Janikovic, D. [3 ]
Sebo, P. [4 ]
Beronska, N. [4 ]
Roshanghias, A. [1 ]
Ipser, H. [1 ]
机构
[1] Univ Vienna, Dept Inorgan Chem Funct Mat, Wahringer Str 42, A-1090 Vienna, Austria
[2] Ivan Franko Natl Univ, Dept Met Phys, Kyrylo & Mephodiy Str 8, UA-79005 Lvov, Ukraine
[3] Slovak Acad Sci, Inst Phys, Dept Met Phys, Dubravska Cesta 9, Bratislava 84511, Slovakia
[4] Slovak Acad Sci, Inst Mat & Machine Mech, Racianska 75, Bratislava 83102, Slovakia
基金
奥地利科学基金会;
关键词
Sn3.0Ag0.5Cu; ceramic nanoparticles; microstructure; shear strength; MECHANICAL-PROPERTIES; COMPOSITE SOLDERS; MICROSTRUCTURE; PARTICLES; ALLOY; BEHAVIOR; GROWTH;
D O I
10.1007/s11664-016-4832-7
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
To date, additions of different oxide nanoparticles is one of the most widespread procedures to improve the mechanical properties of metals and metal alloys. This research deals with the effect of minor ceramic nanoparticle additions (SiO2, TiO2 and ZrO2) on the microstructure and mechanical properties of Cu/solder/Cu joints. The reinforced Sn3.0Ag0.5Cu (SAC305) solder alloy with 0.5 wt.% and 1.0 wt.% of ceramic nanoparticles was prepared through mechanically stirring. The microstructure of as-solidified Cu/solder/Cu joints was studied using scanning electron microscopy. The additions of ceramic nanoparticles suppressed the growth of the intermetallic compound layer Cu6Sn5 at the interface solder/Cu and improved the microstructure of the joints. Furthermore, measurements of mechanical properties showed improved shear strength of Cu/composite solder/Cu joints compared to joints with unreinforced solder. This fact related to all investigated ceramic nanoinclusions and should be attributed to the adsorption of nanoparticles on the grain surface during solidification. However, this effect is less pronounced on increasing the nanoinclusion content from 0.5 wt.% to 1.0 wt.% due to agglomeration of nanoparticles. Moreover, a comparison analysis showed that the most beneficial influence was obtained by minor additions of SiO2 nanoparticles into the SAC305 solder alloy.
引用
收藏
页码:6143 / 6149
页数:7
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