Preparation and characterization of nanoporous Cu6Sn5/Cu composite by chemical dealloying of Al-Cu-Sn ternary alloy

被引:8
作者
Feng, Yefei [1 ]
Zhang, Shichao [1 ]
Xing, Yalan [1 ,2 ]
Liu, Wenbo [1 ]
机构
[1] Beihang Univ, Sch Mat Sci & Engn, Beijing 100191, Peoples R China
[2] Beijing Inst Aeronaut Mat, Beijing 100095, Peoples R China
基金
中国国家自然科学基金;
关键词
SIZE DISTRIBUTIONS; CO-AG; MICROSTRUCTURE; BEHAVIOR; SILVER; FILMS; METALS; COPPER;
D O I
10.1007/s10853-012-6453-8
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this article, a new ternary Al-Cu-Sn alloy system has been exploited to fabricate nanoporous Cu6Sn5/Cu composite slices through chemical dealloying in a 20 wt% NaOH solution at an elevated temperature. The microstructure of the sliced nanoporous Cu6Sn5/Cu composite was characterized using x-ray diffraction, scanning electron microscopy, energy dispersive X-ray analysis, and transmission electron microscopy. The experimental results show that multi-phase precursor alloy comprises alpha-Al, Sn, and theta-Al2Cu phases. The new phase Cu6Sn5 emerges through dealloying, and the as-dealloyed samples have three-dimensional (3D) structure composed of large-sized channels (hundreds of nanometers) and small-sized channels (tens of nanometers). Both the large- and small-sized pores are 3D, open and bicontinuous. The synergetic dealloying of alpha-Al and theta-Al2Cu in the three-phase Al-Cu-Sn alloy and fast surface diffusion of Cu atoms and Sn atoms result in the formation of Cu6Sn5/Cu composite with bimodal channel size distributions. In addition, the dealloying duration plays a significant role in the formation of Cu6Sn5 and the length scales of the small-sized ligament/channels at a settled temperature.
引用
收藏
页码:5911 / 5917
页数:7
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