Theoretical study of the impact of stress on the behavior of intrinsic point defects in large-diameter defect-free Si crystals

被引:0
|
作者
Sueoka, K. [1 ]
Kamiyama, E. [1 ]
Vanhellemont, J. [2 ]
机构
[1] Okayama Prefectural Univ, Kuboki 111, Okayama 7191197, Japan
[2] Univ Ghent, Krijgslaan 281 S1, B-9000 Ghent, Belgium
来源
GETTERING AND DEFECT ENGINEERING IN SEMICONDUCTOR TECHNOLOGY XV | 2014年 / 205-206卷
关键词
Thermal stress; Point defects; Defect-free Si crystal; Density functional study; Void;
D O I
10.4028/www.scientific.net/SSP.205-206.163
中图分类号
O59 [应用物理学];
学科分类号
摘要
For the development of the crystal pulling process for 450 mm-diameter defect-free Si crystals, the impact of thermal stress on intrinsic point defect behavior during crystal growth is studied using extensive density functional theory calculations. The impact of thermal stress on the so-called Voronkov criterion and on void formation is clarified and compared with published experimental results.
引用
收藏
页码:163 / +
页数:2
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