Theoretical analysis of a Love wave biosensor in liquid with a viscoelastic wave guiding layer

The Love mode surface acoustic wave biosensor is considered as one of the most promising probing methods in biomedical research and diagnosis, which has been applied to detect the mechano-biological behaviors of cells attached to the surface of the device. Recent studies have reported the structural and functional optimization of Love wave biosensors for reducing propagation loss and improving sensitivity; however, the relevant device performance needs to be analyzed in depth in terms of device structure, electromechanical properties of piezoelectric crystal substrates, viscoelastic properties of wave guiding layers, and the effect of liquid loading. In this study, a 36 degrees YX-LiTaO3 based Love wave sensor with a parylene-C wave guiding layer is considered as a cell-based biosensor. A theoretical model is proposed to describe the Love wave propagation in the wave guiding layer and penetration in the liquid medium. Decay length delta for the Love wave penetration in liquid is found to be in the order of similar to 50 nm, which agrees well with experimental observations. In addition, the effects of the viscoelastic wave guiding layer and liquid medium on the effective electromechanical coupling coefficient K-2 of the sensor, the propagation loss PL, and sensor response to mass loading (mass sensitivity) are investigated. The numerical results indicate that the maximum propagation velocity is found at h/lambda = 0, where h is the thickness of the wave guiding layer and lambda is the wavelength; and the optimal coupling coefficient and mass sensitivity can be obtained at h/lambda = 0.045 and h/lambda = similar to 0.06 in a vacuum or similar to 0.058 in water, respectively. For a good combination of these device performance parameters, it is suggested that the optimal wave guiding layer thickness in a Love wave biosensor is at the vicinity of h/lambda = similar to 0.05 in a vacuum and similar to 0.048 in liquid (water). Published by AIP Publishing.