Future pulse plating of silver

被引：6

作者：

Farr, J. P. G. ^{[1
]}

机构：

[1] Univ Birmingham, Sch Engn, Birmingham B15 2TT, W Midlands, England

来源：

TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING | 2008年 / 86卷 / 05期

关键词：

Pulse plating; Silver; Electrode Kinetics;

D O I：

10.1179/174591908X345031

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The knowledge base relating to the conventional ( cyanide) silver electroplating process is surveyed, briefly. The results of impedance measurements made at rotating disc cathodes during deposition from electrolytes containing, respectively, levelling and brightening agents are compared with those from additive-free solutions. Time and polarsation effects are noted that suggest directions for future work on pulse-plating.

引用

页码：275 / 279

页数：5

共 27 条

[11]

Fischer H., 1954, ELEKTROLYTISCHE ABSC

[12]

GERISCHER H, 1958, Z PHYS CHEM, V14, P184

[13] Pulse plating of nickel: influence of electrochemical parameters and composition of electrolyte [J].

Halmdienst, M. ;

Hansal, W. E. G. ;

Kattenhauser, G. ;

Kautek, W. .

TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2007, 85 (01) :22-26

[14] Influence of pulse plating parameters on morphology and hardness of pure tin deposit [J].

Hansal, W. E. G. ;

Halmdienst, M. ;

Hansal, S. ;

Boussaboua, I. ;

Darchen, A. .

TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2008, 86 (02) :115-121

[15]

HANSAL WEG, 2008, T IMF, V86, P7

[16]

Lozano-Morales Alonso, 2008, Metal Finishing, V106, P27, DOI 10.1016/S0026-0576(08)80056-6

[17]

LUCE BM, 1974, MODERN ELECTROPLATIN, P358

[18] Pulse plating of sacrificial Mn-Cu alloys from sulphate bath [J].

Mangolini, F. ;

Magagnin, L. ;

Cavallotti, P. L. .

TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2007, 85 (01) :27-33

[19] Modelling of Faradaic current profiles during pulse reverse plating [J].

Pearson, T .

TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2005, 83 (04) :171-180

[20]

RAUB E, 1967, FUNDAMENTALS METAL D

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