Relationships between young's modulus, hardness and orientation of grain in polycrystalline copper

被引：0

作者：

Guo Zhendan ^{[1
,2
]}

Wang Xiafang ^{[2
]}

Yang Xiaoping ^{[2
]}

Jiang Dongmei ^{[1
]}

Ma Xueming ^{[1
]}

Song Hongwei ^{[2
]}

机构：

[1] E China Normal Univ, State Key Lab Opt & Magnet Resonance Spect, Dept Phys, Shanghai 200062, Peoples R China

[2] Baoshan Iron & Steel Co Ltd, Baosteel Technol Ctr, Shanghai 201900, Peoples R China

来源：

ACTA METALLURGICA SINICA | 2008年 / 44卷 / 08期

关键词：

polycrystalline copper; crystallographic orientation; nanoindentation; electron back-scattering diffraction (EBSD); Young's modulus; hardness;

D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

Nanoindentation and electron back-scattering diffraction (EBSD) techmologies were employed to characterize the mechanical properties and crystallographic orientations of grains in mercial pure copper. It, was found that there is obvious regularity for the Young's modulus of grains as a function of minimum angel between the normal direction < hkl > of grain and < 000 > or < 001 > direction. The nearer the < hkl > to < 111 > direction, the higher the Young's moduhis is and the nearer the to < 001 > direction. the lower the Young's modulus is. There are no obvious regularitics for the Young's modulus as a function of minimum angle between the < hkl > and < 110 > direction, and the hardness of grains as a function of minimum angle between the < hkl > and < 111 >, < 110 > or < 001 > direction. The above results were discussed by theoretical calculations.

引用

页码：901 / 904

页数：4

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