Effect of a new pretreatment on the microstructure and thermal conductivity of Cu/diamond composites

被引：54

作者：

Bai, Hua ^{[1
]}

Ma, Nangang ^{[1
]}

Lang, Jing ^{[2
]}

Zhu, Congxu ^{[1
]}

机构：

[1] Huazhong Univ Sci & Technol, State Key Lab Plast Forming Simulat & & Mould Tec, Wuhan 430074, Peoples R China

[2] Huazhong Univ Sci & Technol, Sch Energy & Power Engn, Wuhan 430074, Peoples R China

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2013年 / 580卷

关键词：

Diamond; Composites; Carbide forming elements; Thermal conductivity; Interfacial layer; DIAMOND COMPOSITES; INFILTRATION; MANAGEMENT; EXPANSION; PARTICLES; MATRIX; POWDER; CR;

D O I：

10.1016/j.jallcom.2013.06.027

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

A new pretreatment method of diamond particle surface was introduced to fabricate the Cu/diamond composites, in which the diamond particles were mixed with copper powder and different carbide former (including B, W) powder at high temperature. Cu/diamond composites were fabricated by spark plasma sintering (SPS) after the surface pretreatment of the diamond powders. The influence of the pretreatment temperature and the carbide forming elements on the microstructure and thermal conductivity of Cu/diamond composites were investigated. These results suggest that the pretreatment process is very effective for producing strong bonding between the diamond particles and Cu matrix. A Cu/diamond composites with high thermal conductivity of 660W (mK)(-1) was obtained, which was achieved by the formation of large number of nanostructures on the diamond particle surface. (C) 2013 Elsevier B.V. All rights reserved.

引用

页码：382 / 385

页数：4

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