UV Direct-Writing of Metals on Polyimide Substrates

被引：1

作者：

Ng, J. H. -G. ^{[1
,2
]}

Desmulliez, M. P. Y. ^{[1
,2
]}

Lamponi, M. ^{[1
,2
]}

Moffat, B. G. ^{[1
,2
]}

Walker, A. C. ^{[2
]}

McCarthy, A. ^{[2
]}

Suyal, H. ^{[2
]}

Prior, K. A. ^{[2
]}

Hand, D. P. ^{[2
]}

机构：

[1] Heriot Watt Univ, MISEC, Edinburgh EH14 4AS, Midlothian, Scotland

[2] Heriot Watt Univ, Sch Engn & Phys Sci, Edinburgh EH14 4AS, Midlothian, Scotland

来源：

ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2008年

基金：

英国工程与自然科学研究理事会;

关键词：

D O I：

10.1109/ESTC.2008.4684434

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Copper micro-patterns have been fabricated on polyimide substrates without the use of evaporation techniques or photoresist materials. A novel easy light-directed metal patterning method has been achieved by using a photoreactive polymer reducing agent, methoxy poly(ethylene glycol) (MPEG) as a thin film coating,. The interaction of UV light and MPEG in ethanol film enables the photoreduction of mobile silver ions previously incorporated within the surface-modified polyimide substrates. The silver nanoparticle patterns thus formed serve as a active catalytic seed layer for subsequent electroless copper plating. Narrow copper tracks with low resistivity close to that of bulk copper have been achieved.

引用

页码：691 / +

页数：2

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