High-Speed TSV Integration in an Active Silicon Photonics Interposer Platform

被引：0

作者：

Bogaerts, L. ^{[1
]}

El-Mekki, Z. ^{[1
]}

Van Huylenbroeck, S. ^{[1
]}

Nolmans, P. ^{[1
]}

Pantano, N. ^{[1
]}

Sun, X. ^{[1
]}

Rakowski, M. ^{[1
]}

Velenis, D. ^{[1
]}

Verheyen, P. ^{[1
]}

Balakrishnan, S. ^{[1
]}

De Heyn, P. ^{[1
]}

Snyder, B. ^{[1
]}

Ban, Y. ^{[1
]}

Srinivasan, S. ^{[1
]}

Lardenois, S. ^{[1
]}

De Coster, J. ^{[1
]}

Detalle, M. ^{[1
]}

Absil, P. ^{[1
]}

Miller, A. ^{[1
]}

Pantouvaki, M. ^{[1
]}

Van Campenhout, J. ^{[1
]}

机构：

[1] IMEC, Kapeldreef 75, B-3001 Leuven, Belgium

来源：

2018 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S) | 2018年

关键词：

TSV; Silicon Photonics Interposer; BEOL;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The growing demand for I/O bandwidth in high-performance applications, such as datacenter switches and HPC nodes, drives the need for on-package integration of Optical I/O modules with the host CMOS ICs [1]. Silicon Photonics (SiPh) is a prime technology platform to realize multi-Tb/s hybrid CMOS-SiPh modules for 1m-500m+ optical interconnect distances [2]. Such Optical I/O modules require interfaces for dense, high-speed electrical I/O and low-noise power and ground delivery, which can be enabled by the integration of through-silicon vias (TSV) into the SiPh platform. Here, we describe challenges and results for 10 mu m x 100 mu m TSV-middle integration into a 300mm SiPh interposer platform. TSVs with low RF loss up to 50GHz are demonstrated along with low SiPh waveguide losses and high-performance Ge photodetectors.

引用

页数：3

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