Adaptive cooling of power modules for reduced power and thermal cycling

被引：0

作者：

Choy, W. J. ^{[1
]}

Castellazzi, A. ^{[1
]}

Zanchetta, P. ^{[1
]}

机构：

[1] Univ Nottingham, Dept Elect & Elect Engn, Nottingham NG7 2RD, England

来源：

PROCEEDINGS OF THE 2011-14TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE 2011) | 2011年

关键词：

Cooling; Active thermal control; Reliability; Power cycling; Regulation;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This work proposes a cooling strategy which responds to changes both in the power dissipation and in the base-plate or heat-sink temperature of power devices and modifies the system thermal impedance accordingly. That allows to reduce both the amplitude of power cycles (i.e., active cycles, due to self-heating effects) and of thermal cycles (i.e., passive cycles, due to changes in ambient temperature), yielding lesser thermo-mechanical stresses and improved system performance and reliability. This paper considers the particular case of forced-convection air-cooling and provides proof-of-concept experimental demonstration of the approach. Though not yet optimised, the potentiality of the proposed cooling strategy is well demonstrated.

引用

页数：10