共 34 条
[1]
ADAMS RM, 1998, P 1998 SAE INT C EXP, P11
[2]
[Anonymous], 1992, IPCSM785
[4]
Chang J, 2006, WELD J, V85, p63S
[5]
Clech J.-P., 1996, SMI. Surface Mount International. Advanced Electronics Manufacturing Technologies. Proceedings of The Technical Program, P136
[7]
CONSTITUTIVE RELATIONS FOR TIN-BASED SOLDER JOINTS
[J].
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY,
1992, 15 (06)
:1013-1024
[8]
Effect of simulation methodology on solder joint crack growth correlation
[J].
50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS,
2000,
:1048-1058
[9]
Darveaux R., 1995, Ball Grid Array Technology, V13, P379
[10]
DARVEAUX R, 1996, P 8 INT C EXP MECH N, P41