Ultra-Wideband Noise Isolation on Power Distribution Network of High-speed Package Substrate

被引：0

作者：

Li, Baoxia ^{[1
]}

Wan, Lixi ^{[1
]}

机构：

[1] Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China

来源：

2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) | 2011年

关键词：

SIMULTANEOUS SWITCHING NOISE; EBG STRUCTURE; SUPPRESSION;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents an effective power noise isolation and suppression method in high-speed package substrates, which is based on planar electromagnetic bandgap (EBG) in local area of power/ground plane and embedded capacitor material between the power and ground planes. Compared with the performance of continuous power and ground planes, the proposed structure provides greater than -40dB isolation in S-parameter simulation at frequency above IGHz, and shows excellent isolation (-70 similar to -140 dB) from 2GHz up to over 30 GHz frequency range. The structure can be used to minimize the risk of power noise interference between different dies from a shared power supply system in board or out of board.

引用

页码：537 / 540

页数：4