共 50 条
- [1] A Method to Measure the Electromagnetic Emission Induced by Electromagnetic Interference of Integrated Circuits 2023 JOINT ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND INTERNATIONAL CONFERENCE ON ELECTROMAGNETIC INTERFERENCE & COMPATIBILITY, APEMC/INCEMIC, 2023, : 47 - 50
- [2] Investigating the Use of Frequency-Modulated Disturbance Injection in Electromagnetic Immunity Testing of Integrated Circuits 2023 JOINT ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND INTERNATIONAL CONFERENCE ON ELECTROMAGNETIC INTERFERENCE & COMPATIBILITY, APEMC/INCEMIC, 2023, : 51 - 54
- [3] Electromagnetic emission of integrated circuits induced by ionizing radiation and its measurement uncertainties ELEKTROTECHNIK UND INFORMATIONSTECHNIK, 2024, 141 (01): : 20 - 28
- [4] Fast Near-Field Characterization of Integrated Circuits Electromagnetic Interference PROCEEDINGS OF THE 21ST INTERNATIONAL CONFERENCE - RADIOELEKTRONIKA 2011, 2011, : 311 - 314
- [5] A Conducted Emissions Modeling Method for Radio Frequency Integrated Circuits 2024 IEEE INC-USNC-URSI RADIO SCIENCE MEETING (JOINT WITH AP-S SYMPOSIUM), 2024, : 352 - 353
- [6] Effects of Ionising Radiation on the Electromagnetic Immunity Behaviour of Integrated Circuits PROCEEDINGS OF THE 2024 IEEE JOINT INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL & POWER INTEGRITY: EMC JAPAN/ASIAPACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, EMC JAPAN/APEMC OKINAWA 2024, 2024, : 609 - 612
- [7] Prediction and Analysis of Electromagnetic Interference in Radio Frequency Propagation for Transmitter - Receiver pair using LabVIEW 2016 14TH INTERNATIONAL CONFERENCE ON ELECTROMAGNETIC INTERFERENCE & COMPATIBILITY (INCEMIC-2016), 2016,
- [9] Radio Frequency Interference Analysis of Camera Module and Antenna in Smartphones 2019 INTERNATIONAL CONFERENCE ON ELECTRONICS, INFORMATION, AND COMMUNICATION (ICEIC), 2019, : 512 - 515
- [10] Radio frequency interference analysis of camera modules and antennas in smartphones IEIE Transactions on Smart Processing and Computing, 2019, 8 (04): : 298 - 305