Electric-field and thermally-activated failure mechanisms of AlGaN/GaN High Electron Mobility Transistors

被引:5
作者
Zanoni, Enrico [1 ]
Meneghesso, Gaudenzio [1 ]
Meneghini, Matteo [1 ]
Stocco, Antonio [1 ]
Rampazzo, Fabiana [1 ]
Silvestri, Riccardo [1 ]
Rossetto, Isabella [1 ]
Ronchi, Nicolo [1 ]
机构
[1] Univ Padua, Dipartimento Ingn Informaz, I-35131 Padua, Italy
来源
GALLIUM NITRIDE AND SILICON CARBIDE POWER TECHNOLOGIES | 2011年 / 41卷 / 08期
关键词
CRITICAL VOLTAGE; DEGRADATION;
D O I
10.1149/1.3631501
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Main failure modes of AlGaN/GaN HEMTs can be divided into three categories: 1) Catastrophic increase of gate leakage, accompanied by an increase in trap density which closely resembles time dependent dielectric breakdown effects of MOS structures; 2) hot-electron and trap-induced effects, which induce increase in parasitic drain resistance and threshold voltage shifts; 3) thermally-activated degradation of drain current, which has been observed especially during long-term accelerated tests, with a very wide range of activation energies, from 1.05 eV to 2.47 eV. In the following, some recent results concerning these three failure modes are presented, together with some hypothesis on the degradation mechanisms involved.
引用
收藏
页码:237 / 249
页数:13
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