Residual Stress and Deformation Analysis of Anodic Bonded Multi-layer of Glass and Aluminum

被引：6
作者：
Liu, Cui-Rong [1 ,2 ]
Lu, Xiao-Ying [1 ]
Yang, Zhen-Yu [3 ]
Meng, Qing-Sen [1 ]
机构：
[1] Taiyuan Univ Technol, China Educ Minist & Shanxi Provence, Key Lab Adv Mat & Interface Sci, Taiyuan 030024, Peoples R China
[2] Taiyuan Univ Sci & Technol, Dept Mat Sci & Engn, Taiyuan 030024, Peoples R China
[3] Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China
来源：
INTERNATIONAL JOURNAL OF NONLINEAR SCIENCES AND NUMERICAL SIMULATION | 2008年 / 9卷 / 04期
基金：
中国国家自然科学基金;
关键词：
Anodic bonding; MEMS; Aluminum; Glass; Residual Stress; Finite element;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The bonding of glass wafer to aluminum foils in multi-layer assemblies was made by the common anodic bonding process. The bonding was performed at temperatures in the range 350-450 degrees C and with an applied voltage in the range 400-700 V under a pressure of 0.05 MPa. Residual stress and deformation in samples of two-layer (aluminum/glass) and three-layer (glass/aluminum/glass) were analyzed by nonlinear finite element simulation software MARC. The stress and strain varying with cooling time were obtained. The analyzed results show that deformation of the three-layer sample is significantly smaller than that of the two-layer sample, because of the symmetric structure of the three-layer sample. This has an important advantage in MEMS fabrication. The maximum equivalent stresses locate in the transition layer in both samples, which will become weakness in bonded sample.
引用
收藏
页码：347 / 353
页数：7
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