Cure-induced and thermal stresses in a constrained epoxy resin

被引:36
|
作者
Merzlyakov, M [1 ]
McKenna, GB [1 ]
Simon, SL [1 ]
机构
[1] Texas Tech Univ, Dept Chem Engn, Lubbock, TX 79409 USA
关键词
thermosetting resins; residual/internal stress; mechanical testing; thermal pressure coefficient;
D O I
10.1016/j.compositesa.2005.05.013
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We report results from a study of isotropic residual stress development for thermosetting resins during cure and subsequent thermal cycling. We use a recently developed thick-walled tube method to impose three-dimensional isotropic constraints oil the resin. The strains at the outer surface of the thick-walled tube are monitored by strain gauges. Experiments are performed for a closed tube where the resin is cured in the compressive state and in an open tube where tensile stresses build up at gelation. The cure-induced tensile stresses are much lower than expected from cure shrinkage due to the inability of the curing resin to sustain large tensile stresses in the gel-state. (c) 2005 Elsevier Ltd. All rights reserved.
引用
收藏
页码:585 / 591
页数:7
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