Design, Fabrication of Through Silicon Vias Based on Suspended Photoresist Thin Film and Its Application in Silicon Interposer

被引：0

作者：

Wu, Ziyang ^{[1
]}

Dou, Chuanguo ^{[1
]}

Wu, Yanhong ^{[1
]}

Yang, Heng ^{[1
]}

机构：

[1] Chinese Acad Sci, State Key Lab Transducer Technol, Sci & Technol Microsyst Lab, Shanghai Inst Microsyst & Informat Technol, Shanghai 200233, Peoples R China

来源：

2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) | 2011年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a novel fabrication method of through silicon vias (TSVs) based on suspended photoresist thin film. The AZ5214 photoresist thin film is self-assembled on the deionized (DI) water surface, then the film is transferred onto the wafer surface and patterned by photolithography to form the cover plates on the through-vias. After a Cu seed layer is deposited and the photoresist film is chemically removed, the through-vias are filled by Cu electroplating. The process steps, characterization and the feasibility are analyzed in our experiment. According to this approach, one of its applications in silicon interposer is provided and the processes are discussed.

引用

页码：400 / 403

页数：4

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