Thermoelastic damping of the in-plane vibration of thin silicon rings

被引:140
作者
Wong, SJ [1 ]
Fox, CHJ [1 ]
McWilliam, S [1 ]
机构
[1] Univ Nottingham, Sch Mech Mat & Mfg Engn, Nottingham NG7 2RD, England
关键词
D O I
10.1016/j.jsv.2005.09.037
中图分类号
O42 [声学];
学科分类号
070206 ; 082403 ;
摘要
This paper considers thermoelastic damping of the in-plane vibration of rings. The work was motivated by the need to gain improved understanding of energy-dissipation effects in silicon MEMS resonators, for which a high Q-factor is often a key design objective. The presented analysis is based on Zener's classical work on the modelling of thermoelastic loss in uniform beams, and on a recent refinement of Zener's analysis by Lifshitz and Roukes. A review of Zener's and Lifshitz and Roukes' analysis is given. The paper then extends the above work by applying the thermoelastic models to the in-plane vibration of uniform rings of rectangular cross-section. Using both approaches, numerical predictions of modal Q-factors are developed and compared. The relationships between ring geometry, scale and Q-factor are explored and the ability to choose resonator dimensions to control Q-factor due to thermoelastic loss is illustrated. (c) 2005 Elsevier Ltd. All rights reserved.
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页码:266 / 285
页数:20
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