Measurement of Silicon Micromachined Waveguide Components at 500-750 GHz

被引：68

作者：

Reck, Theodore J. ^{[1
]}

Jung-Kubiak, Cecile ^{[1
]}

Gill, John ^{[1
]}

Chattopadhyay, Goutam ^{[1
]}

机构：

[1] CALTECH, Jet Prop Lab, Pasadena, CA 91106 USA

来源：

IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY | 2014年 / 4卷 / 01期

关键词：

Rectangular waveguide; silicon micromachining; submillimeter-wave; terahertz (THz) frequencies;

D O I：

10.1109/TTHZ.2013.2282534

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents techniques used to assemble and measure micromachined submillimeter-wave waveguide circuits operating from 500 to 750 GHz. A novel micromechanical compression pin is developed to improve wafer-to-wafer alignment to less than 1 mu m. Connection between the silicon waveguide and the VNA is aligned through a silicon boss that inserts into the custom waveguide flange. Waveguide loss is characterized for both E- and H-plane split waveguides and is found to be similar to standard metal waveguides. Finally, measurement of a 3 dB hybrid coupler operating from 500 to 600 GHz is presented.

引用

页码：33 / 38

页数：6

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