Dislocation distribution across ultrathin silicon-on-insulator with epitaxial SiGe stressor

被引:6
作者
Bonera, Emiliano [1 ,2 ]
Gatti, Riccardo [1 ,2 ,3 ]
Isella, Giovanni [4 ,5 ]
Norga, Gerd [4 ,5 ]
Picco, Andrea [1 ,2 ]
Grilli, Emanuele [1 ,2 ]
Guzzi, Mario [1 ,2 ]
Texier, Michael [6 ]
Pichaud, Bernard [6 ]
von Kaenel, Hans [4 ,5 ]
Miglio, Leo [1 ,2 ]
机构
[1] Univ Milano Bicocca, LNESS, I-20125 Milan, Italy
[2] Univ Milano Bicocca, Dipartimento Sci Mat, I-20125 Milan, Italy
[3] CNRS ONERA, Lab Etud Microstruct, F-92322 Chatillon, France
[4] L NESS, I-22100 Como, Italy
[5] Politecn Milan, Polo Reg Como, I-22100 Como, Italy
[6] Aix Marseille Univ, IM2NP, UMR CNRS 7334, Fac Sci & Tech St Jerome, F-13397 Marseille, France
关键词
RELAXATION;
D O I
10.1063/1.4817071
中图分类号
O59 [应用物理学];
学科分类号
摘要
We studied the plastic deformation of an ultrathin silicon-on-insulator with epitaxial Si1-xGex by transmission electron microscopy, Raman spectroscopy, and finite-element method. We analyzed a top Si layer of 10 nm (testing also a 2 nm layer) with epitaxial Si0.64Ge0.36 stressors of 50 and 100 nm. SiGe plastically deforms the top Si layer, and this strain remains even when Si1-xGex is removed. For low dislocation densities, dislocations are gettered close to the Si/SiO2 interface, while the SiGe/Si interface is coherent. Beyond a threshold dislocation density, interactions between dislocations force additional dislocations to position at the Si1-xGex/Si interface. (C) 2013 AIP Publishing LLC.
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页数:4
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