Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface

被引：6
|
作者：
Iwasaki, N [1 ]
Yanagibashi, M
Tsunetsugu, H
Kato, K
Ishitsuka, F
Hosoya, M
Kikuchi, H
机构：
[1] Nippon Telegraph & Tel Corp, Telecommun Energy Labs, Kanagawa 2430198, Japan
[2] Nippon Telegraph & Tel Corp, Elect Corp, Kanagawa 2430032, Japan
[3] Nippon Telegraph & Tel Corp, Elect Corp, Tokyo 1500043, Japan
来源：
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2001年 / 24卷 / 04期
关键词：
coplanar waveguide (CPW); flip-chip structure; impedance matching; MU-connector; optical receiver; solder bump;
D O I：
10.1109/6040.982825
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A compact 40-Gb/s optical receiver module with an MU-connector interface has been developed. Its packaging has three main technical features. 1) Coplanar waveguide (CPW) patterns of the waveguide photodiode (WG-PD) and of the preamplifier IC in the facing area of the flip-chip structure are optimized for impedance matching. 2) A film carrier is used to connect the preamplifier IC to an electrical coaxial connector for electrical signal output. 3) An MU-connector is used as the optical interface to reduce the module size. Optimum design enabled a module size of 14.0 mm wide, 40.4 mm long, and 9.65 mm high. Measurements showed a 3-dB down bandwidth of the optical/electrical response of at least 50 GHz and a clear open eye pattern for a 40-Gb/s nonreturn-to-zero (NRZ) signal input. This optical receiver module is suitable for large-capacity communication network systems.
引用
收藏
页码：429 / 433
页数：5
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