3D SiP Simulation Technology and Application

被引：5
|
作者：
Suny Li [1 ,2 ,3 ]
机构：
[1] Beijing ESOON Technol Co LTD, Beijing 100020, Peoples R China
[2] AcconSys Beijing Technol Co LTD, Beijing 100020, Peoples R China
[3] Zhaotai Int Ctr, 501A,Block C,3 Chaowai West St, Beijing, Peoples R China
来源：
ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY | 2019年
关键词：
3D SiP; 3D EM simulation; 2D simulation; S-parameter; eye diagram;
D O I：
10.1109/ICEPT47577.2019.245761
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper mainly outlines a 3D SiP (System-in-package) project simulation flow, describes the 3D SiP simulation technology detailed. Generally, the 3D SiP simulation consists of two sections, the first section is to import the design data into a full wave 3D EM simulation tool, to extract the S-Parameter for nets. Then in the second section, put the S-Parameter into a 2D simulation tool, to get the signal waveform or eye diagram. In this paper, we detailed describe the 3D SiP simulation requirements and processes, simulation flow, design data translation, 3D EM model extraction, eye diagram simulation and etc. Finally we get the simulation result and present the conclusion and optimization suggestions.
引用
收藏
页数：4
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