Wafer yield is one of the most critical indicators of product quality in semiconductor manufacturing companies. An accurate prediction can reduce the subsequent inspection process, improve production efficiency and reduce product scrap. However, existing end-to-end data-driven wafer yield prediction methods ignore the batch nature of the wafer production process, resulting in poor generalization of the prediction model in different batch wafers. Therefore, an improved XGBoost-based multi-batch wafer yield prediction model is proposed to address this problem. A multi-task learning mechanism is designed to realize the extraction of batch features, and a fusion training mechanism is established to realize the prediction output. Finally, the effectiveness of the prediction method is verified by experimental data collected from the real wafer fabrication process. Copyright (C) 2022 The Authors.
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West Virginia Univ, Dept Management Informat Syst, Morgantown, WV USAWest Virginia Univ, Dept Management Informat Syst, Morgantown, WV USA
Choi, Jeongsub
Zhu, Mengmeng
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North Carolina State Univ, Dept Text Engn Chem & Sci, Raleigh, NC 27606 USA
North Carolina State Univ, Operat Res Grad Program, Raleigh, NC 27695 USAWest Virginia Univ, Dept Management Informat Syst, Morgantown, WV USA
Zhu, Mengmeng
Kang, Jihoon
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Tech Univ Korea, Business Adm, Shihung, South KoreaWest Virginia Univ, Dept Management Informat Syst, Morgantown, WV USA
Kang, Jihoon
Jeong, Myong K.
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State Univ New Jersey Rutgers, Dept Ind & Syst Engn, Piscataway, NJ 08901 USAWest Virginia Univ, Dept Management Informat Syst, Morgantown, WV USA