Understanding creep mechanisms of a Cu-Cr-Nb alloy by testing under constant structure conditions

被引：10

作者：

Zhang, M. ^{[1
]}

Gibeling, J. C. ^{[1
]}

机构：

[1] Univ Calif Davis, Dept Mat Sci & Engn, One Shields Ave, Davis, CA 95616 USA

来源：

SCRIPTA MATERIALIA | 2021年 / 190卷 / 190期

基金：

美国国家航空航天局;

关键词：

Creep; Copper alloys; Thermally activated processes; Dislocation structure; Dislocation-particle interaction; PURE; PARTICLES; KINETICS; CLIMB;

D O I：

10.1016/j.scriptamat.2020.08.036

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Stress reduction creep tests conducted on a Cu-Cr-Nb alloy (GRCop-84) at 923 K have confirmed local dislocation climb to be the rate-controlling deformation mechanism. The activation energy of creep was measured to be consistent with that of self-diffusion in Cu matrix. An internal back stress of approximately -9 MPa was identified to act on the rate-controlling dislocations, which is believed to be the sum of the back stress for dislocation-particle interaction and the forward stress for dislocation-dislocation interaction. This back stress, however, does not lead to a true threshold in the framework of thermally activated dislocation motion. (C) 2020 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：131 / 135

页数：5

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