Formation of AuSnx IMCs in Sn3.5Ag0.75Cu micro-solder joints fabricated by laser and hot air reflow processes

被引：4
作者：
Liu, Wei [1 ,2 ]
Tian, Yanhong [1 ]
Wang, Chunqing [1 ]
Sun, Lining [2 ]
机构：
[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China
[2] Harbin Inst Technol, Mech Engn Postdoctoral Mobile Res Stn, Harbin 150001, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2013年 / 24卷 / 01期
基金：
中国国家自然科学基金;
关键词：
EUTECTIC SOLDER; AG SOLDER; AU; RELIABILITY; SN; MICROSTRUCTURE; STABILITY; SUBSTRATE; STRENGTH; KINETICS;
D O I：
10.1007/s10854-012-0715-8
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The present study aims to investigate morphology and distribution of AuSnx IMCs (Intermetallic Compounds) in laser and hot air reflowed micro-solder joints. Diameter of Sn3.5Ag0.75Cu solder balls used in the experiments was 120 mu m. Thickness of Au surface finish on pads of the joints was 0.1, 3.0 or 4.0 mu m. In solder joints fabricated by the laser reflow (LR) process, most AuSnx IMCs were in needle-like or dendritic shape, and located near interfaces of solder and pads. Whereas, the AuSnx IMCs within the solder joints fabricated by the hot air reflow (HR) process presented in fibrous or faceted shape, and distributed all over the solder joints. Diversity of morphology and distribution of AuSnx IMCs in the LR and HR solder joints is caused by different characteristics of heat source, different solidification rate of solder joints, and different reaction time between Au and Sn in the two reflow processes.
引用
收藏
页码：217 / 223
页数：7
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