Voltage-Controlled Cycling Endurance of HfOx-Based Resistive-Switching Memory

被引:86
作者
Balatti, Simone [1 ]
Ambrogio, Stefano [1 ]
Wang, Zhongqiang [1 ]
Sills, Scott [2 ]
Calderoni, Alessandro [2 ]
Ramaswamy, Nirmal [2 ]
Ielmini, Daniele [1 ]
机构
[1] Politecn Milan, Italian Univ Nanoelect Team, Dipartimento Elettron Informaz & Bioingn, I-20133 Milan, Italy
[2] Micron Technol Inc, Boise, ID 83707 USA
关键词
Cycling endurance; device modeling; memory reliability; resistive-switching memory (RRAM); DRIVEN ION MIGRATION; PART I;
D O I
10.1109/TED.2015.2463104
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Resistive-switching memory (RRAM) based on metal oxide is currently considered as a possible candidate for future nonvolatile storage and storage-class memory. To explore possible applications of RRAM, the switching variability and the cycling endurance are key issues that must be carefully understood. To this purpose, we studied the switching variability and the endurance in pulsed regime for HfOx-based RRAM. We found that the resistance window, the set/reset variability, and the endurance are all controlled by the maximum voltage V-stop, which is applied during the negative-reset operation. We demonstrate that the endurance failure is triggered by a negative-set event, where the resistance suddenly decreases during the reset. Cycling endurance is studied as a function of time, compliance current and V-stop, allowing to develop an Arrhenius-law model, which is capable of predicting device lifetime under various conditions.
引用
收藏
页码:3365 / 3372
页数:8
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